Films and coatings for circular packaging vs Microelectronic – Front-End Module (FEM)
Side-by-side comparison of two grants.
| Attribute | Films and coatings for circular packaging | Microelectronic – Front-End Module (FEM) |
|---|---|---|
| Type | Grant | Grant |
| Funding amount | $8M | $16M |
| Deadline | Closes 2026-09-22 | Closes 2026-09-03 |
| Region | EU | EU |
| Sector | Research | Research |
| Funder | European Commission (HORIZON) | European Commission (HORIZON) |
| Who it's for | researchers | researchers |