Alternatives to Early Warning Systems Communications Specialist

Expected Impact: Projects funded under this call are expected to deliver tangible industrial outputs that demonstrably advance the readiness and affordability of future governmental Ka-band user terminals for IRIS2 and GOVSATCOM services. Expected outputs include, for example: qualified production processes, calibrated sub-assemblies, pilot-run units, validated manufacturing equipment chains or manufacturing cost models. Purely analytical deliverables (studies, design reports) are not sufficient as primary outputs but may complement the above. Where relevant, outputs shall include documented design assumptions, interface parameters or process specifications enabling adaptation to different terminal configurations with limited re-engineering, so as to support uptake in follow-on integration, pilot deployment and scale-up activities. Objective: The aim of this call for proposals is to advance the industrial readiness of European Ka-band user terminal technologies, subsystems and manufacturing processes, with a view to enabling cost-effective production of user terminals for services provided under the Union secure connectivity programme (IRIS²) and GOVSATCOM. The target reference…

Expected Outcome: The targeted outcomes reflect the above challenges and cover a comprehensive Front End module design which: Covers the FR3 range as defined by the relevant Agenda Item of WRC 27 (7 to 15 GHz range) with possible extension up to 24 GHz if required by some regional implementations, with inherent tuning capabilities to accommodate potential regional variations. Mitigates interferences with incumbent FR3 band users and maximises sharing capabilities across the band in line with the European regulatory approach on spectrum sharing. Enables integration of a large number of antenna elements beyond the State of the Art and support massive MIMO implementation with compensation of increased path loss compared to 5G FR1 implementations. Enables at least an order-of-magnitude increase in RF processing compared to 5G FR1 implementations. Enables 5G cell site reuse and minimises deployment complexity on top of 5G sites deployment. Enables low-cost and low energy implementation of the elementary constituent modules, efficient packaging and is mainly based on the integration of microelectronics heterogeneous technologies where European industry has strong expertise and…

Expected Outcome: Objectives and profile of the ERC Plus Grant Principal Investigator The ERC Plus Grant supports outstanding Principal Investigators who address a major scientific challenge. Applications for ERC Plus Grants should be for projects that could not be carried out with a regular ERC grant. Applicants should explain how the proposed project aims go beyond those of a regular ERC project, for example, because they have a vision to transform their field or open a new field of research. Scholars at all career stages can apply for an ERC Plus Grant if they have an outstanding record of scientific achievement at the forefront of their field. Their intellectual leadership will be evaluated in comparison to peers at their own career stage. It is expected that a researcher may be the Principal Investigator of only one ERC Plus Grant in their lifetime. Applicants should be aware that every year, only some 30 ERC Plus Grants can be awarded across all fields and all career stages, compared to approximately 1000 Starting, Consolidator and Advanced Grants. This level of competitiveness should be taken into account when considering whether to submit an application. Size of ERC Plus…

Expected Outcome: The expected outcomes of this topic are : A common EU evaluation platform for AI chips and racks, with transparent KPIs, workloads and benchmark reports used for Chips JU selection and procurement decisions. First pilot deployments of European AI compute systems validated for EU sovereign partitions of AI infrastructure. Structured collaboration between buyers and suppliers, supporting deployment, integration and optimisation of European AI compute solutions. Stronger EU demand for European AI chips and racks, helping to create a market for deployment-ready solutions. Increased EU technological sovereignty across the AI compute stack for European datacentres.

Scope: Proposals innovations should address one or more of the several domains : WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions. WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain. A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes. Next generation or optimised new power semiconductor devices fitting their application. Adding intelligence to power semiconductor devices on control and/or sensor side. Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging. Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide…

Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration.

Expected Outcome: This action will establish a strategic European initiative to develop scalable, modular, and interoperable photonic quantum computing platforms. Proposals for this topic are expected to address and provide credible solutions to at least two major technical roadblocks currently limiting the advancement of photonic quantum computing such as: The lack of deterministic, high-efficiency photonic entanglement and loss-tolerant architectures suitable for fault-tolerant scaling The absence of a standardised, integrated control stack combining photonic hardware, firmware, and system software with reliable benchmarking across platforms Project results are expected to contribute to the following expected outcomes: By 2028, demonstration of a photonic NISQ processor with ≥100 photonic qubits, integrating deterministic single-photon sources, low-loss waveguides, on-chip detectors, and a firmware stack (scheduler, controller, compiler), validated via hardware-agnostic benchmarks and hybrid photonic-HPC applications demonstrating classical-quantum crossover By 2030, delivery of a full-stack, high-connectivity photonic quantum computer, with modular scalability, integrated…

Expected Outcome: Expected outcomes: A sustained pipeline of highly qualified semiconductor graduates, with shorter time-to-readiness for industry roles; greater inflow of diverse talent including women and underrepresented groups; improved intra- and extra-EU student mobility; and strong complementarity with existing Chips Act infrastructure such as pilot lines, design platforms, and Competence Centres. Scope: This call funds the creation of specialised academic "Hubs of Excellence" in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.

Expected Outcome: Projects should contribute to all of the following expected outcomes: Insights, recommendations, strategies, guidelines, methods and tools supporting full AI integration in CCSI practices become available to CCSI, policymakers, and stakeholders. Scenarios for co-created solutions tailored to CCSI needs, utilizing quality data and federated data sources, along with digital infrastructures, and inclusive cooperation processes, become available. Generally made available AI-powered and ethically designed solutions, tools and services in several CCSI areas benefit creators, cultural professionals, and society, including persons with disabilities and other specific needs, fostering innovative creative expressions and improving creative business models while preserving and enhancing cultural diversity, and inclusion. By mastering ethical and inclusive AI, CCSI are empowered drivers of culture, innovation, competitiveness and societal wellbeing. Scope: AI technologies are transformative, providing unprecedented opportunities for human creativity, experimentations and co-creations. AI profoundly impacts cultural and creative sectors and industries, changing practices,…

Expected Outcome: This flagship pilot is the culmination of the entire activity catalogue carried out by the CCAM Partnership since its launch in 2021. It will combine in one project the most promising CCAM use-cases across three key domains, with the technological advancements from all its R&I clusters [1] supporting and enabling CCAM systems and services towards market uptake. This action is expected to contribute to all the following outcomes: Large-scale demonstrations of inclusive, user-oriented, and well-integrated CCAM systems and services for people and goods in mixed traffic through Field Operational Tests (FOTs), Technology Pilots, and Living Labs, building upon advanced and emerging SAE Level 2 systems to move towards SAE Level 3 and 4 functionalities, at multiple test sites and corridors showcasing CCAM potential [2] , for a minimum of 12 months. Validation of enabling technologies that facilitate the extension of Operational Design Domains (ODDs) in large-scale operations and enhance perception performance under poor lighting and adverse weather conditions in large-scale demonstrations and pilots. Assessment of deployment readiness and demonstration of technological…

Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Expected Outcome: Proposals are expected to contribute to all following points: The projects must fulfil the performance targets, at the cell and system level, corresponding to the specific targeted application, to be specified in the proposal. Appropriate KPI must be defined for the energy density (volumetric and gravimetric), Power density and C-rate, number of cycles and cost defined under operational conditions. Boost EU competitiveness in next-generation battery technologies for mobility applications. Develop pilot manufacturing capability for next generation lithium-based batteries. Strengthen the EU battery value chain, including new manufacturing equipment, automation, and scalable production processes. Advance the understanding of next-generation battery interfaces at an industrial scale, ensuring manufacturability, durability, and cost-effectiveness. In the case of aviation, the battery requirements should be compatible at minimum with EASA CS.23 (level 4), CS.27 and preferably with CS.25 categories. Scope: This topic will support the scaling-up of next generation (i.e., beyond generation 3) lithium-based batteries (e.g., semi and all-solid state, generation5) from cell…