France – Energy and related services – Marché Public Global de Performance pour l'exploitation des installations de chauffage, froid, ventilation, production ECS, traitement des eaux

France – Topographical services – Accord-cadre de relevés et prestations topographiques

France – Legal services – Accord-cadre prestations de consultation juridique, de rédaction d'actes juridiques et de formation

France – Survey services – Prestation de diagnostics accessibilité pour les personnes âgées et les personnes handicapées

France – Health and safety consultancy services – PARC DE STATIONNEMENT ROTONDE, RAMBOT, SIEGE DE LA SEMEPA ET PROPRIETES DE LA SEMEPA AIX EN PROVENCE MISSION DE COORDINATION SPS

France – Feasibility study, advisory service, analysis – Assistance à maîtrise d'ouvrage pour l'étude de stratégie de solarisation des toitures des écoles de la Ville de Nîmes

France – Laboratory services – PRESTATIONS D’ANALYSE GENOMIQUE D’ADN ENVIRONNEMENTAL POUR LE LEEISA

Expected Outcome: Expected outcomes: A sustained pipeline of highly qualified semiconductor graduates, with shorter time-to-readiness for industry roles; greater inflow of diverse talent including women and underrepresented groups; improved intra- and extra-EU student mobility; and strong complementarity with existing Chips Act infrastructure such as pilot lines, design platforms, and Competence Centres. Scope: This call funds the creation of specialised academic "Hubs of Excellence" in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.

Expected Outcome: Europe's first long-term VET provider network for semiconductors; a larger and more diverse pool of qualified technicians; and increased intra- and extra-EU mobility of students and workers to fill skills gaps in semiconductor facilities. Scope: This call supports the establishment of a European-level federation of Vocational Education and Training (VET) providers focused on semiconductor industry roles. Projects should develop industry-aligned micro-credentials and reskilling programmes, with a strong emphasis on workers transitioning from other industrial sectors and on cross-border recognition of qualifications.

The Federal Transit Administration (FTA) announces the opportunity to apply for competitive awards totaling up to $10 million in Public Transportation Innovation Program (49 U.S.C. 5312) funds for the Fiscal Year (FY) 2026 Bus Safety, Accessibility, and Innovation Research Program under Assistance Listing Number 20.530. As required by Federal public transportation law, funds will be awarded competitively to up to two projects to develop and prototype innovative and widely deployable concepts that are intended to make existing and new buses safer for their operators and vulnerable road users, and safer and more accessible for their passengers. 

Expected Outcome: Practical chip design experience integrated into education at multiple levels; at least 1,000 students across Europe completing funded tape-outs over 4 years; stronger reskilling pathways for students from adjacent fields; and a sustainable, continent-wide pipeline of chip design talent to support Europe's semiconductor ambitions. Scope: This call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs. At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.