Latvia – Road-maintenance works – Limbažu novada pašvaldības grants seguma ielu un ceļu uzturēšana vasaras sezonā

Latvia – Surface work for streets – Rīgas ielas, Zaļās ielas, Līvānos posmu seguma atjaunošana un Autoceļa S02 “Sutri - Ragaviki” pārbūve Sutru pagastā, Līvānu novadā” 1. kārta

Latvia – Construction work for electricity power lines – Vidsprieguma līniju izbūve un pārbūve Mārupes, Ķekavas, Olaines, Salaspils un Saulkrastu novados (6 daļas: IO-258207, IO-228365, IO-224017, IO-248204, IO-228273, IO-259487)

Latvia – Construction work – Daugavpils Zinātņu vidusskolas un Daugavpils Centra vidusskolas sporta nodarbību telpu apdares un inženiertīklu atjaunošana/ierīkošana

Latvia – Restructuring work – Raunas pamatskolas ēkas pārbūve

Latvia – Construction work – Būvdarbu veikšana objektam - Edgara Kauliņa Lielvārdes vidusskolas telpu vienkāršotā pārbūve, Ogres novadā

Latvia – Construction work for water and sewage pipelines – VISPĀRĪGĀ VIENOŠANĀS PAR ŪDENSSAIMNIECĪBAS INFRASTRUKTŪRAS IZBŪVES UN/VAI PĀRBŪVES PROJEKTU ĪSTENOŠANU

Expected Outcome: the proposals under this call are expected to address one or more of the following subjects : • Enhanced personalized monitoring, care and treatments, focusing on the development of highly customized healthcare solutions, including the required research and diagnostic tools, tailored to individual needs, covering various scenarios such as chronic disease management, physiotherapy, precision diagnosis, personalized medicine/treatment, pre- and postoperative care, and daily assistance in homes and common spaces. It also targets effective management of chronic diseases and elderly care through personalized monitoring and interventions facilitated by advanced sensor technologies and edge-to-cloud solutions. This includes the development and integration of solutions for Hospitalization at Home, enabling patients to receive complex, remotely supervised care using intelligent medical devices capable of sensing, analysing, and transmitting real-time data. This requires a continuum, from in-hospital diagnostics to robust, long-term patient support at home via AI-driven care pathways and hospitalization at home. • Prevention and treatment of diseases, allowing the improved…

Scope: Proposals innovations should address one or more of the several domains : WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions. WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain. A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes. Next generation or optimised new power semiconductor devices fitting their application. Adding intelligence to power semiconductor devices on control and/or sensor side. Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging. Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide…

UK registered organisations can apply for a share of up to £121 million across the three strands of this competition for innovative clean maritime technologies. This funding is from the Department for Transport (DfT).

Expected Outcome: Proposals submitted to this call are expected to address several of the following elements: • Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes. • Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration. • Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches. • Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks. • Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.