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IA Resilience call reinforcing Europe's strength in photonics

Grant· European Commission (HORIZON)· EU· updated 2026-07-07
Funding amount
$11.4M
Deadline
Closes 2026-09-16
View & apply on official source

Expected Outcome: Proposals submitted to this call are expected to address several of the following elements: • Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes. • Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration. • Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches. • Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks. • Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.

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Eligibility
Open to organisations in EU member states and associated countries. Call type: HORIZON JU Innovation Actions.

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