Alternatives to Procurement of a server, software, server drives and monitors forThe Ukrainian Center for Educational Quality Assessment (UCEQA)

Procurement of Computer and Telecommunications Equipment

Сonsultancy service provision by Consultant (legal entity (consulting firm)) for the ESG (Environmental, Social, and Corporate Governance) focused Training and Workshops (Capacity Building on O&M and Safety)

Procurement of a Robotic Welding Cell for Stepan Gzhytskyi National University of Veterinary Medicine and Biotechnologies Lviv and Admiral Makarov National University of Shipbuilding

Procurement of a Portable Metal Analyzer

Procurement of Equipment for the Marine Educational and Research Center of Experimental Studies of Odesa I.I. Mechnikov National University

Specialist for Development of Innovation Ecosystem and International Science, Technology and Innovation (STI) Cooperation

ECPE Model Diversification Expert

Quality Assurance Expert

Data Analyst Expert

Specialist in Innovation Policy Implementation and Institutional Capacity Development for Supporting the Innovation Ecosystem

Expected Outcome: Europe's first long-term VET provider network for semiconductors; a larger and more diverse pool of qualified technicians; and increased intra- and extra-EU mobility of students and workers to fill skills gaps in semiconductor facilities. Scope: This call supports the establishment of a European-level federation of Vocational Education and Training (VET) providers focused on semiconductor industry roles. Projects should develop industry-aligned micro-credentials and reskilling programmes, with a strong emphasis on workers transitioning from other industrial sectors and on cross-border recognition of qualifications.

Expected Outcome: Practical chip design experience integrated into education at multiple levels; at least 1,000 students across Europe completing funded tape-outs over 4 years; stronger reskilling pathways for students from adjacent fields; and a sustainable, continent-wide pipeline of chip design talent to support Europe's semiconductor ambitions. Scope: This call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs. At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.