CHILDREN AND YOUNG PEOPLE FOSTER CARE Flexible Purchasing System (FPS)

The Life Sciences Transformational R&D Investment Fund Pilot offers capital grants to support large-scale R&D projects in the UK life sciences sector (eligible projects must exceed £100 million in total costs). It aims to boost research and development within the UK's Life Sciences sector by supporting large-scale investments focused on innovation and strengthening health resilience, as well as projects with the potential to generate economic benefits. This fund complements the separate Life Sciences Innovative Manufacturing Fund (LSIMF).

UK registered businesses can apply for funding for life science manufacturing capital investment projects which help increase UK health resilience.

The Tree Health Pilot (THP) scheme is testing different ways of slowing the spread of pests and diseases affecting trees in England. It expands on support available through the Countryside Stewardship Woodland Tree Health grant. The THP supports owners and managers of trees in woodland or trees outside woodland to deal with tree health issues. Funding from the pilot can go towards a range of measures including: felling and treating diseased or infested trees and necessary infrastructure improvements; restocking with new trees and capital items to assist this; maintenance of newly planted trees biosecurity items. he Tree Health Pilot guidance on GOV.UK sets out the aims of the pilot in detail including eligibility and application details.

Payments are available for farmers in England for vet visits and diagnostic testing to reduce endemic diseases, improve productivity, and raise welfare standards across herds and flocks. It is part of the wider Animal Health and Welfare Pathway. The grant provides direct payments to livestock keepers to cover the cost of these vet visits.

UK registered organisations can apply for a share of up to £150 million. The funding will be to develop, deploy and operate innovative clean maritime solutions for three years in a real world environment. This funding is from the Department for Transport.

Expected Outcome: Proposals submitted to this call are expected to address several of the following elements: • Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes. • Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration. • Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches. • Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks. • Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.

Expected Outcome: the proposals under this call are expected to address one or more of the following subjects : • Enhanced personalized monitoring, care and treatments, focusing on the development of highly customized healthcare solutions, including the required research and diagnostic tools, tailored to individual needs, covering various scenarios such as chronic disease management, physiotherapy, precision diagnosis, personalized medicine/treatment, pre- and postoperative care, and daily assistance in homes and common spaces. It also targets effective management of chronic diseases and elderly care through personalized monitoring and interventions facilitated by advanced sensor technologies and edge-to-cloud solutions. This includes the development and integration of solutions for Hospitalization at Home, enabling patients to receive complex, remotely supervised care using intelligent medical devices capable of sensing, analysing, and transmitting real-time data. This requires a continuum, from in-hospital diagnostics to robust, long-term patient support at home via AI-driven care pathways and hospitalization at home. • Prevention and treatment of diseases, allowing the improved…

Expected Outcome: The proposals under this topic should address the design/specification and implementation/testing of the key microelectronics building blocks of an FR3 FEM paving the way towards their future integration into a complete integrated FEM system. • Progresses the State of the art to optimise the cost-performance trade off to serve the target ITU IMT 2030 specifications, notably for what concerns maximum data rate, user data rate, spectral efficiency, whilst enabling 50% mobile transmission system energy consumption; • Allows operational implementation of spectrum sharing with other spectrum users within the selected FR3 sub-band; • Enables large arrays integration for increased path loss compensation at FR3 frequencies with very compact, low power, high efficiency FEM integration; • Enables high bandwidth for carrier aggregation with broadband RF transceivers; • Enables SBFD (Sub-Band non overlapping Full-Duplex) for UL coverage extension (Rel.-19 5G-Advanced in 3GPP) with appropriate interference cancellation techniques; • Enables ISAC (Integrated Sensing and Communications) supporting monostatic as well as bistatic radar functionality, and addressing interference…

UK registered organisations can apply for a share of up to £150 million. The funding will be to develop, deploy and operate innovative clean maritime solutions for three years in a real world environment. This funding is from the Department for Transport.

Scope: Proposals innovations should address one or more of the several domains : WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions. WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain. A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes. Next generation or optimised new power semiconductor devices fitting their application. Adding intelligence to power semiconductor devices on control and/or sensor side. Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging. Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide…