University of Bristol grants

Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.

Funding is available to purchase a laser-based photonic component testing system which is capable of rapidly modifying the wavelength (>100 nm/s sweep rate) with a high level of precision (sub-picometer wavelength resolution). Such a system must also be able to accurately measure the wavelength-dependent power to allow for characterisation of a device under test (DUT). Such a system would strongly complement the photonics capabilities available to the QTIC/BIZ community.