European Commission (DIGITAL) grants

Expected Outcome: The expected outcomes of this topic are : A common EU evaluation platform for AI chips and racks, with transparent KPIs, workloads and benchmark reports used for Chips JU selection and procurement decisions. First pilot deployments of European AI compute systems validated for EU sovereign partitions of AI infrastructure. Structured collaboration between buyers and suppliers, supporting deployment, integration and optimisation of European AI compute solutions. Stronger EU demand for European AI chips and racks, helping to create a market for deployment-ready solutions. Increased EU technological sovereignty across the AI compute stack for European datacentres.

Expected Outcome: Practical chip design experience integrated into education at multiple levels; at least 1,000 students across Europe completing funded tape-outs over 4 years; stronger reskilling pathways for students from adjacent fields; and a sustainable, continent-wide pipeline of chip design talent to support Europe's semiconductor ambitions. Scope: This call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs. At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.

Expected Outcome: Expected outcomes: A sustained pipeline of highly qualified semiconductor graduates, with shorter time-to-readiness for industry roles; greater inflow of diverse talent including women and underrepresented groups; improved intra- and extra-EU student mobility; and strong complementarity with existing Chips Act infrastructure such as pilot lines, design platforms, and Competence Centres. Scope: This call funds the creation of specialised academic "Hubs of Excellence" in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.

Expected Outcome: Europe's first long-term VET provider network for semiconductors; a larger and more diverse pool of qualified technicians; and increased intra- and extra-EU mobility of students and workers to fill skills gaps in semiconductor facilities. Scope: This call supports the establishment of a European-level federation of Vocational Education and Training (VET) providers focused on semiconductor industry roles. Projects should develop industry-aligned micro-credentials and reskilling programmes, with a strong emphasis on workers transitioning from other industrial sectors and on cross-border recognition of qualifications.

Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Expected Outcome: The expected outcomes of this topic are : Functional demonstrators of working AI chip prototypes (PCB-level) designed by EU fabless companies and physically integrated with their system partners. Validation of AI chip solutions on a common EU evaluation platform (provided by the Topic X.B consortium), delivering comparative evidence on key performance indicators. A shortlist of European AI chip solutions awarded the AI Compute Excellence label and qualified to proceed to full rack development under Topic X.A2.